- Strong adhesion between resin and plating film interface (peel strength ≧ 6N/cm)
- Ultra-thin plating film (thinnest: 0.1 μm)
- Uniform plating following holes and irregularities of the object
Characteristics of non-electrolytic plating resin film
Material composition
Prototype example
Example applications
- Copper-clad resin laminates
- Electromagnetic shielding
- Current collectors for batteries
- Various electronic components