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  • Strong adhesion between resin and plating film interface (peel strength ≧ 6N/cm)
  • Ultra-thin plating film (thinnest: 0.1 μm)
  • Uniform plating following holes and irregularities of the object
Non-electrolytic plating resin film

Characteristics of non-electrolytic plating resin film

Material composition

Material composition

Prototype example

Example applications

  • Copper-clad resin laminates
  • Electromagnetic shielding
  • Current collectors for batteries
  • Various electronic components