- Strong adhesion between resin and plating film interface (peel strength ≧ 6N/cm)
- Ultra-thin plating film (thinnest: 0.1 μm)
- Uniform plating following holes and irregularities of the object
![Non-electrolytic plating resin film](/contents/wp-content/uploads/2024/03/35_sub_thum.jpg)
Characteristics of non-electrolytic plating resin film
Material composition
![Material composition](/contents/wp-content/uploads/2024/03/en_35_composition_01.webp)
Prototype example
![LCP/Cu plated film](/contents/wp-content/uploads/2024/01/35_example_01.webp)
![Cu plating on perforated film](/contents/wp-content/uploads/2024/03/en_35_example_02.webp)
Example applications
- Copper-clad resin laminates
- Electromagnetic shielding
- Current collectors for batteries
- Various electronic components