LCP base (for subtractive processes)
Laminated with non-roughened copper foil and LCP film, FCCL offer smooth interfacing and excellent high-frequency characteristics
- Provided width: Max. 510 mm
- Format: Rolls, sheets
Composition
Low transmission loss
Achieving good shape for wiring using subtractive method
General properties
| Item | Conditions | Non-roughened copper foil FCCL |
|---|---|---|
| Conductor peel strength (N/mm) | 18 µm rolled copper foil at room temperature | 0.6 |
| Elongation | 38% | 13% |
| Dielectric dissipation factor | Open resonant Fabry–Perot method 28GHz | 0.002 |
| Relative dielectric constant | 3.3 | |
| Solder heat resistance | 288°C, 10 seconds | No abnormality |
The above data are representative values measured by our company, not guaranteed values
LCP base (Laminated ultra-thin copper foil with carrier/For fine wiring)
Laminated ultra-thin copper foil with carrier and LCP, FCCL applicable to MSAP
Carrier copper foil can be peeled off easily and evenly.
- Provided width: Max. 510 mm
- Format: Rolls, sheets
Composition
Ultra-thin copper layer lamination with low roughness
Conventional design Rz: 1.3 μm*
Low roughness design Rz: 0.9 μm*
Copper foil manufacturer’s nominal roughness
Achieves fine wiring using MSAP
General properties
| Item | Conditions | Copper foil with carrier FCCL |
|---|---|---|
| Conductor peel strength | 18 µm thickness after plating At room temperature JIS C 6481 | 1.0 N/mm |
| Cross section after peeling off carrier copper foil | room temperature | 0.03 N/mm |
| Dielectric dissipation factor | Open resonant Fabry–Perot method 28GHz | 0.002 |
| Relative dielectric constant | 3.3 | |
| Solder heat resistance | 288°C, 10 seconds | No abnormality |
The above data are representative values measured by our company, not guaranteed values
LCP base (Ultra-thin plating/For fine wiring)
Ultra-thin copper of 0.1 to 0.3 μm laminated on LCP by non-electrolytic plating
FCCL enables fine wiring processing and excels in high-frequency characteristics
FCCL enables fine wiring processing and excels in high-frequency characteristics
Composition
Excellent high-frequency characteristics achieved by interface smoothing
Achieves fine wiring using SAP
General properties
| Item | Conditions | Non-electrolytic copper plating (FCCL) |
|---|---|---|
| Conductor peel strength | 18 µm thickness after plating At room temperature | 0.7 N/mm |
| 18 µm thickness after plating After 168 hours at 150°C | 0.7 N/mm | |
| Dielectric dissipation factor | Open resonant Fabry–Perot method 28GHz | 0.002 |
| Relative dielectric constant | 3.3 | |
| Solder heat resistance | 260°C, 5 seconds | No abnormality |
The above data are representative values measured by our company, not guaranteed values